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High Precision 2D Laser Solder Paste Thicknes Inspection Machine
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High Precision 2D Laser Solder Paste Thicknes Inspection Machine
  • Name

High Precision 2D Laser Solder Paste Thicknes Inspection Machine

Markenbezeichnung: HXT
Modellnummer: SH-110-2D
MOQ: 1
Preis: 1200
Verpackungsdetails: Wodden-Kasten
Zahlungsbedingungen: T/T
Ausführliche Information
Produkt-Beschreibung
Ausführliche Information
Herkunftsort:
China
Zertifizierung:
CE
Messgenauigkeit:
±0,001 mm (±1 µm)
Wiederholungsgenauigkeit:
±0,002 mm (±2 µm)
Grundabmessungen:
320 mm * 500 mm * 360 mm
Optische Vergrößerung:
25* – 110* (5-stufig einstellbar)
Bildauflösung:
600 * 480 Pixel
Gewicht:
30 KG
Versorgungsmaterial-Fähigkeit:
1000 pro Monat
Produkt-Beschreibung
2D Solder Paste Thickness Inspection Machine
High Precision 2D Laser Solder Paste Thicknes Inspection Machine 0
Brief Introduction (Optimized for Buyers)

As Surface Mount Technology (SMT) advances, electronic components become increasingly smaller, packaging density becomes denser, and solder joints shrink correspondingly. Nearly 70% of PCB assembly defects are caused by improper solder paste printing.

The SH-110-2D Solder Paste Thickness Inspection Machine is designed to solve this problem. It effectively identifies potential defective solder deposits before component placement, provides accurate SPC control data (CPK, Cp), and significantly reduces defect rates.

In today's competitive electronic manufacturing environment, lower defect rates translate directly into higher profits. Strict process control requires factories to demonstrate their capability in managing solder paste printing during production. This machine provides that proof.

Beyond Solder Paste: The SH-110-2D can also be used in other production fields. Any geometric information of objects and components within 10 mm height can be precisely and non-contact measured.

Technological Parameters
Parameter Specification
Measurement Principle Non-contact laser triangulation
Measurement Accuracy ±0.001 mm (±1 µm)
Repeat Measurement Accuracy ±0.002 mm (±2 µm)
Base Dimensions (L*W*H) 320 mm * 500 mm * 360 mm
Platform Type Fixed marble platform (vibration-dampening)
Image System VGA high-definition camera
Optical Magnification 25* – 110* (5-step adjustable)
Measurement Light Source High-definition red laser
Illumination Adjustable annular LED (PC-controlled brightness)
Image Resolution 600 * 480 pixels
Software SH-110 / SPC100 (compatible with all Windows OS)
Power Supply 95–240 V AC, 50 Hz, 1000 mA
Weight 30 kg
Application Area
Category Measurable Features
Solder Paste Thickness, Area, Volume, Gap, Angle, Length, Width, Arc
Irregular Geometric Sizes Any non-standard shape within 10 mm height
PCB & Printing Ink Circuit line width, Pad height, Dimensional measurement
Electronic Components Horizontal coplanarity
Image Processing Image capture, Video processing, Documentary management
SPC Statistical Analysis CPK, Cp, and print output with full reporting
Standard Configuration (Included in Package)
Item Quantity
SH-110-2D Main Unit 1
Software Package (CD/USB) 1
Video Capture Card 1
Transmission Line 1
Video Signal Line 1
Software Encryptor (Dongle) 1
Corrective Gauges (Calibration Tool) 1
Power Cable 1
Operating Manual 1
Operating Principle (Technical Explanation for Engineers)

The non-contact thickness gauge emits a very fine laser beam at a fixed incident angle onto the measurement target. Because the target (solder paste) and its surrounding substrate (PCB surface) differ in height, the reflected sensor receives multiple laser differences.

Based on the observed data, the analysis program—using trigonometric functions—rapidly calculates and outputs precise information about the measurement target, including height, width, area, and derived volume.

Tags: 

Spi-Maschine in SMT  

Lötpaste-Inspektions-Maschine  

SMT-Inspektions-Maschine

Guter Preis Online

Einzelheiten Zu Den Produkten

Haus > Produits >
SMT SPI-Maschine
>
High Precision 2D Laser Solder Paste Thicknes Inspection Machine
Alle Kategorien

Auswahl- und Platzmaschine

Rückflutofen

Maschine SMTs AOI

Druckmaschine für das Schweißen mit Paste

SMT SPI-Maschine

SMT-Maschinenlinie

Automatische Einfügemaschine

Wellenlötermaschine

SMT-Laderentlader Maschine

smt Förderer

Klebeverteilmaschine

Konforme beschichtende Maschine

Heizofenmaschine

PWB-Schneidemaschine

Elektronikproduktionsmaschinerie

PCB-Maschine
High Precision 2D Laser Solder Paste Thicknes Inspection Machine
  • Name

High Precision 2D Laser Solder Paste Thicknes Inspection Machine

Markenbezeichnung: HXT
Modellnummer: SH-110-2D
MOQ: 1
Preis: 1200
Verpackungsdetails: Wodden-Kasten
Zahlungsbedingungen: T/T
Ausführliche Information
Produkt-Beschreibung
Ausführliche Information
Herkunftsort:
China
Markenname:
HXT
Zertifizierung:
CE
Modellnummer:
SH-110-2D
Messgenauigkeit:
±0,001 mm (±1 µm)
Wiederholungsgenauigkeit:
±0,002 mm (±2 µm)
Grundabmessungen:
320 mm * 500 mm * 360 mm
Optische Vergrößerung:
25* – 110* (5-stufig einstellbar)
Bildauflösung:
600 * 480 Pixel
Gewicht:
30 KG
Min Bestellmenge:
1
Preis:
1200
Verpackung Informationen:
Wodden-Kasten
Lieferzeit:
30 Tage
Zahlungsbedingungen:
T/T
Versorgungsmaterial-Fähigkeit:
1000 pro Monat
Produkt-Beschreibung
2D Solder Paste Thickness Inspection Machine
High Precision 2D Laser Solder Paste Thicknes Inspection Machine 0
Brief Introduction (Optimized for Buyers)

As Surface Mount Technology (SMT) advances, electronic components become increasingly smaller, packaging density becomes denser, and solder joints shrink correspondingly. Nearly 70% of PCB assembly defects are caused by improper solder paste printing.

The SH-110-2D Solder Paste Thickness Inspection Machine is designed to solve this problem. It effectively identifies potential defective solder deposits before component placement, provides accurate SPC control data (CPK, Cp), and significantly reduces defect rates.

In today's competitive electronic manufacturing environment, lower defect rates translate directly into higher profits. Strict process control requires factories to demonstrate their capability in managing solder paste printing during production. This machine provides that proof.

Beyond Solder Paste: The SH-110-2D can also be used in other production fields. Any geometric information of objects and components within 10 mm height can be precisely and non-contact measured.

Technological Parameters
Parameter Specification
Measurement Principle Non-contact laser triangulation
Measurement Accuracy ±0.001 mm (±1 µm)
Repeat Measurement Accuracy ±0.002 mm (±2 µm)
Base Dimensions (L*W*H) 320 mm * 500 mm * 360 mm
Platform Type Fixed marble platform (vibration-dampening)
Image System VGA high-definition camera
Optical Magnification 25* – 110* (5-step adjustable)
Measurement Light Source High-definition red laser
Illumination Adjustable annular LED (PC-controlled brightness)
Image Resolution 600 * 480 pixels
Software SH-110 / SPC100 (compatible with all Windows OS)
Power Supply 95–240 V AC, 50 Hz, 1000 mA
Weight 30 kg
Application Area
Category Measurable Features
Solder Paste Thickness, Area, Volume, Gap, Angle, Length, Width, Arc
Irregular Geometric Sizes Any non-standard shape within 10 mm height
PCB & Printing Ink Circuit line width, Pad height, Dimensional measurement
Electronic Components Horizontal coplanarity
Image Processing Image capture, Video processing, Documentary management
SPC Statistical Analysis CPK, Cp, and print output with full reporting
Standard Configuration (Included in Package)
Item Quantity
SH-110-2D Main Unit 1
Software Package (CD/USB) 1
Video Capture Card 1
Transmission Line 1
Video Signal Line 1
Software Encryptor (Dongle) 1
Corrective Gauges (Calibration Tool) 1
Power Cable 1
Operating Manual 1
Operating Principle (Technical Explanation for Engineers)

The non-contact thickness gauge emits a very fine laser beam at a fixed incident angle onto the measurement target. Because the target (solder paste) and its surrounding substrate (PCB surface) differ in height, the reflected sensor receives multiple laser differences.

Based on the observed data, the analysis program—using trigonometric functions—rapidly calculates and outputs precise information about the measurement target, including height, width, area, and derived volume.

Tags: 

Spi-Maschine in SMT

Lötpaste-Inspektions-Maschine

SMT-Inspektions-Maschine

+86 16620793861
Schnelle Verbindung
Haus ÜBER US produits Anwendung Neuigkeiten Fälle Treten Sie mit uns in Verbindung
Schnelle Kontaktaufnahme

Adresse

Gebäude Nr. 142 / B311, Songyu Road, Gemeinde Hongxing, Straße Songgang, Bezirk Baoan, Shenzhen, China.

Telefon

+86-16620793861

+86 16620793861
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